X-Series Packages
An X-Series package is the smallest and lightest connector assembly in the catalog: it terminates in a Molex X3 connector (16 to 64 channels) or three Panasonic 96-pin connectors (128 channels) that an X-Series headstage mates directly, with no adapter, for chronic implants where head mass is the limit.
The X-Series headstage that mates it digitizes at the head on an Intan RHD or RHS chip, weighs 0.9 to 1.5 g, and streams to XDAQ over one micro-HDMI cable; the record-only models add a 3-axis accelerometer and the stim-record models pass current through the array for record-and-stimulate protocols on XDAQ. X3-16, X3-32 and X3-64 are cable-less for acute work; the X3-H and X6 builds have a 10 to 30 mm flexible cable for a chronic implant. Bodies are UV epoxy. The X-Series connector does not mate SmartLink or third-party headstages; where those are required, a conventional package on Omnetics is the choice.
Compatible silicon designs: any catalog probe of matching channel count, 1 to 16 shanks, 2 to 60 mm, in all four site layouts. Channel count follows from connector size: 16, 32 and 64 channels on one or two X3 connectors, 128 on three Panasonic 96-pin.
Research use only.
Typical values
| Channels | 16 · 32 · 64 · 128 |
|---|---|
| Connector | Molex X3 ×1 or ×2 (16 to 64) · Panasonic 96 ×3 (128) |
| Headstage | X-Series, direct |
| Cable | none (X3) · 10 to 30 mm (X3-H, X6) |
| Body | UV epoxy |