ZIF Package Series
Hardware
A ZIF package terminates in Hirose zero-insertion-force connectors that mate TDT ZIF-Clip headstages: a cam holds the contacts open while the headstage is seated, so the mating force on the implant is near zero.
Builds are Z16, Z32 and Z64, each on a pair of Hirose connectors (16/32 at 16 and 32 channels, 64 at 64 channels) in epoxy; OZ16LP and OZ32LP add an optical fiber. The 16-channel ZIF also mates a SmartLink 16 headstage directly, which streams to XDAQ or Smartbox; the 32- and 64-channel builds are for ZIF-Clip systems, or connect to a NeuroNexus headstage through a connector adapter. The connector has a moving part in the implant, which the CM and X-Series packages do not.
Compatible silicon designs: 1 to 8 shanks, 2 to 15 mm, in all four site layouts, sites usually 177 µm².
Research use only.
Typical values
| Channels | 16 · 32 · 64 |
|---|---|
| Connector | Hirose 16/32 ×2 · Hirose 64 ×2 (ZIF-Clip) |
| Headstage | TDT ZIF-Clip; SmartLink 16 direct on Z16 |
| Variants | optoelectrode (OZ16LP, OZ32LP) |